Microstructure and Mechanical Properties of Sn–0.7Cu Flip Chip Solder Bumps Using Stencil Printing Method
نویسندگان
چکیده
منابع مشابه
Defect Inspection of Flip Chip Solder Bumps Using an Ultrasonic Transducer
Surface mount technology has spurred a rapid decrease in the size of electronic packages, where solder bump inspection of surface mount packages is crucial in the electronics manufacturing industry. In this study we demonstrate the feasibility of using a 230 MHz ultrasonic transducer for nondestructive flip chip testing. The reflected time domain signal was captured when the transducer scanning...
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Detailed three-dimensional finite element analysis was carried out for area-array solder-bumped flip-chip packages. The analysis enabled determinations of accurate three-dimensional effects on stress distributions as well as local fracture behaviors under thermal load. The 3D analysis also estimated thermal fatigue life of solder bumps. Since dimensions of various components span more than thre...
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Using detailed finite element models, a fracture analysis of solder bumps and under bump metallurgy (UBM) in flip-chip packages is carried out. Our objective is to identify likely fracture modes and potential delamination sites at or near these microstructural components. In order to study flip-chips, whose dimension spans from sub-micron thickness UBM layers to several millimeters wide package...
متن کاملEffect Of Underfill On Flip-Chip Solder Bumps: An Experimental Study By Microscopic Moiré Interferometry
Thermo-mechanical deformations of flip-chip interconnections on an organic substrate are investigated by microscopic moiré interferometry. A detailed experimental procedure for microscopic moiré experiments is described and the effect of specimen preparation is discussed. Two identical packages, one with and the other without underfill, are investigated. They are subjected to a uniform thermal ...
متن کاملTechnical challenges of stencil printing technology for ultra fine pitch flip chip bumping
Stencil printing remains the technology route of choice for flip chip bumping because of its economical advantages over traditionally costly evaporation and electroplating processes. This paper provides the first research results on stencil printing of 80 μm and 60 μm pitch peripheral array configurations with Type 7 Sn63/Pb37 solder paste. In specific, the paste particle size ranges from 2 μm ...
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ژورنال
عنوان ژورنال: MATERIALS TRANSACTIONS
سال: 2005
ISSN: 1345-9678,1347-5320
DOI: 10.2320/matertrans.46.2366